Routing in the Third Dimension: From VLSI Chips to MCMs

王朝导购·作者佚名
 
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  分类: 图书,进口原版,Medicine(医学),Reference(参考书),
  品牌: Naveed A. SherwaniSiddharth BhingardeAnand Panyam

基本信息出版社:Wiley-IEEE Press; 1 (1995年3月1日)丛书名:Ieee Press Series on Microelectronic Systems精装:376页正文语种:英语ISBN:0780310896条形码:9780780310896商品尺寸:16.1 x 2.5 x 23.4 cm商品重量:689 gASIN:0780310896商品描述内容简介This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.目录Preface.

Acknowledgments.

Introduction.

Graphs and Basic Algorithms.

Channel Routing and Terminal Assignment.

Routing Models.

Basic Problems in Routing.

Routing Algorithms for the Two-Layer Process.

Routing Algorithms for the Three-Layer Process.

Routing Algorithms for the Advanced Three-Layered Process.

Routing Algorithms for Advanced VLSI and Thin-Film MCMs.

Routing Algorithms for General MCMs.

Bibliography.

Author Index.

Subject Index.

 
 
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